The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Jan. 30, 2018
Applicant:

Multibase S.a., Saint Laurent du Pont, FR;

Inventors:

Aurelie Arrigoni, Saint Laurent du Pont, FR;

Sylvain Boucard, Pont de Beauvoisin, FR;

Assignee:

MULTIBASE S.A., Saint Laurent du Pont, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 87/00 (2006.01); C08J 5/18 (2006.01); C08L 83/04 (2006.01); A44C 5/00 (2006.01);
U.S. Cl.
CPC ...
C08L 87/005 (2013.01); C08J 5/18 (2013.01); C08L 83/04 (2013.01); A44C 5/0053 (2013.01); C08J 2383/07 (2013.01); C08J 2387/00 (2013.01); C08J 2483/07 (2013.01); C08J 2487/00 (2013.01); C08L 2203/16 (2013.01); C08L 2207/04 (2013.01); C08L 2310/00 (2013.01);
Abstract

A thermoplastic elastomer composition comprising a blend of (A) a thermoplastic organic polyether block amide copolymer, (B) a silicone composition comprising (B1) a silicone base comprising (B1a) a diorganopolysiloxane polymer having a viscosity of at least 1000000 mPa·s at 25° C. and an average of at least 2 alkenyl groups per molecule and (B1b) a reinforcing filler in an amount of from 1 to 50% by weight based on the weight of (B1a), (B2) an organohydrido silicone compound which contains an average of at least 2 silicon-bonded hydrogen groups per molecule, (C) a hydrosilylation catalyst, and optionally: one or more additives component (D), wherein the weight ratio of thermoplastic organic polyether block amide copolymer (A) to the silicone composition (B) is in the range 50:50 to 95:5, and wherein component (B2) and (C) are present in an amount sufficient to cure said silicone composition (B1).


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