The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Mar. 22, 2018
Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Adam K. Schmitt, Midland, MI (US);

David H. Bank, Midland, MI (US);

Bharati Balijepalli, Midland, MI (US);

Daniel Schneider, Waedenswil, CH;

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/04 (2006.01); C08J 5/04 (2006.01); C08L 63/00 (2006.01); B32B 5/26 (2006.01); C08G 59/26 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); C08G 59/40 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); B32B 5/26 (2013.01); C08G 59/26 (2013.01); C08G 59/3218 (2013.01); C08G 59/38 (2013.01); C08G 59/4021 (2013.01); C08G 59/686 (2013.01); C08J 5/04 (2013.01); C08J 5/042 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); B32B 2262/106 (2013.01); B32B 2363/00 (2013.01); B32B 2605/00 (2013.01); C08J 2363/00 (2013.01); C08J 2363/04 (2013.01); C08J 2451/00 (2013.01); C08J 2463/00 (2013.01); C08J 2475/04 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01); C08L 2205/05 (2013.01); C08L 2205/06 (2013.01);
Abstract

A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite.


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