The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Jun. 24, 2016
Applicants:

Nitto Shinko Corporation, Sakai, JP;

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Yasuyuki Kihara, Fukui, JP;

Akira Tamai, Fukui, JP;

Hiroichi Ukei, Osaka, JP;

Tomoyuki Kasagi, Osaka, JP;

Mizuki Yamamoto, Osaka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/02 (2006.01); B32B 27/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); C08L 81/06 (2006.01); H01B 3/30 (2006.01); C09D 181/06 (2006.01); C08J 5/18 (2006.01); C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
B32B 5/022 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/286 (2013.01); B32B 27/34 (2013.01); C08J 5/18 (2013.01); C08L 81/06 (2013.01); C09D 181/06 (2013.01); H01B 3/301 (2013.01); H01B 3/305 (2013.01); H01B 3/308 (2013.01); B32B 2250/40 (2013.01); B32B 2262/0269 (2013.01); B32B 2270/00 (2013.01); B32B 2307/206 (2013.01); B32B 2307/306 (2013.01); B32B 2307/54 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); C08J 2377/06 (2013.01); C08J 2381/08 (2013.01); C08L 77/06 (2013.01); Y10T 428/2848 (2015.01); Y10T 428/31533 (2015.04); Y10T 442/674 (2015.04);
Abstract

The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.


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