The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

May. 22, 2019
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Yusuke Watanabe, Shiojiri, JP;

Kei Yokota, Matsumoto, JP;

Yuichi Sasage, Suwa, JP;

Kenta Anegawa, Matsumoto, JP;

Seiichiro Yamashita, Azumino, JP;

Mitsuru Inutsuka, Kawagoe, JP;

Kakeru Sasagawa, Matsumoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/314 (2017.01); B29C 45/76 (2006.01); B29C 45/47 (2006.01); B33Y 30/00 (2015.01); B29C 64/393 (2017.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); B29C 64/209 (2017.01);
U.S. Cl.
CPC ...
B29C 64/314 (2017.08); B29C 45/47 (2013.01); B29C 45/76 (2013.01); B29C 64/209 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B29C 2945/76658 (2013.01);
Abstract

A plasticizing device includes a first member having a groove portion that has a spiral shape extending to a center, a motor that rotates the first member, a second member that faces the first member, and a heating unit for heating a material that is transported along the groove portion, the first member having a plurality of recessed portions on a bottom surface of the groove portion. By providing a plurality of recessed portions on the bottom surface of the first member through which the material flows, the rotational force of the rotating first member is easily transmitted to the material and the amount of material flowing in the first member can be increased.


Find Patent Forward Citations

Loading…