The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Dec. 08, 2017
Applicant:

Sauer Gmbh, Stipshausen, DE;

Inventors:

Martin Reisacher, Kempten, DE;

Peter Hildebrand, Pfronten, DE;

Assignee:

SAUER GmbH, Stipshausen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/38 (2014.01); B23K 26/402 (2014.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B23K 2103/172 (2018.08); B29C 2791/009 (2013.01);
Abstract

The invention relates to a method for machining a multi-layer workpiece blank () by means of a laser beam, comprising the following steps: specifying a machining program for machining the workpiece blank according to an ablation geometry in order to generate a desired edge and/or surface geometry () using a laser machining device; tensioning the workpiece blank in the laser machining device and positioning the workpiece holder in a measuring position; measuring a thickness of at least one of the layers of the multi-layer workpiece blank (); modifying the machining program in order to machine the multi-layer workpiece blank () according to the measured layer thickness with an consistent ablation geometry; and machining the tensioned workpiece blank () using the modified machining program via a laser of the laser machining device in order to generate the desired edge and/or surface geometry () with a cutting edge (). The invention also relates to a correspondingly configured device.


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