The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Oct. 23, 2015
Applicant:

Jfe Steel Corporation, Tokyo, JP;

Inventors:

Kohei Furumai, Hamilton, CA;

Naomichi Iwata, Handa, JP;

Norichika Aramaki, Fukuyama, JP;

Yuji Miki, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 11/108 (2006.01); B22D 11/04 (2006.01); B22D 11/055 (2006.01); B22D 11/059 (2006.01);
U.S. Cl.
CPC ...
B22D 11/108 (2013.01); B22D 11/04 (2013.01); B22D 11/055 (2013.01); B22D 11/059 (2013.01);
Abstract

Continuous casting mold is provided having a mold copper plate having plural separate portions filled with foreign metal formed by filling concave grooves formed on the inner wall surface of the mold copper plate and having a diameter of 2 mm to 20 mm in the inner wall surface at least in the region from a meniscus to a position located 20 mm or more lower than the meniscus with the foreign metal whose thermal conductivity is 80% or less or 125% or more of the mold copper plate, the ratio of the Vickers hardness HVc of the mold copper plate to the Vickers hardness HVm of the filling metal satisfies expression (1), and the ratio of the thermal expansion coefficient αc of the mold copper plate and the thermal expansion coefficient αm of the filling metal satisfies expression (2).0.3≤HV/HV≤2.3  (1),0.7≤α≤3.5  (2)


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