The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Aug. 02, 2019
Applicant:

Cummins Emission Solutions Inc., Columbus, IN (US);

Inventors:

Matthew Anderson, Columbus, IN (US);

Arpad Somogyvari, Indianapolis, IN (US);

Assignee:

CUMMINS EMISSION SOLUTIONS INC., Columbus, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/28 (2006.01); F01N 3/28 (2006.01); B01D 53/86 (2006.01); F01N 3/021 (2006.01); B01J 21/02 (2006.01); B01J 31/06 (2006.01); B01J 35/00 (2006.01); B01J 35/02 (2006.01); B01J 37/00 (2006.01); B01J 37/02 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
B01D 53/86 (2013.01); B01J 21/02 (2013.01); B01J 31/06 (2013.01); B01J 35/0006 (2013.01); B01J 35/02 (2013.01); B01J 37/0009 (2013.01); B01J 37/0217 (2013.01); B32B 3/28 (2013.01); B32B 15/08 (2013.01); F01N 3/0211 (2013.01); F01N 3/2842 (2013.01); F01N 3/2853 (2013.01); F01N 3/2875 (2013.01); B01D 2255/9025 (2013.01); B01J 2231/005 (2013.01); B01J 2531/002 (2013.01); B01J 2531/008 (2013.01); F01N 2330/20 (2013.01); Y02T 10/12 (2013.01);
Abstract

An aftertreatment component for use in an exhaust aftertreatment system. The aftertreatment component comprises an aftertreatment substrate and a compressible material. The compressible material may be formed from a plastic thermoset, a rubberized material, or a metal foil which permits for the selective expansion of the substrate within the compressible material, while also reducing cost and manufacturing complexity. In various embodiments, the aftertreatment substrate and the compressible materials may be formed separately and coupled to each other, or they may be formed concurrently via coextrusion.


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