The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Sep. 24, 2019
Applicant:

Nano and Advanced Materials Institute Limited, Hong Kong, HK;

Inventors:

Yong Zhu, Hong Kong, HK;

Cheuk Yin Lee, Hong Kong, HK;

Chenmin Liu, Hong Kong, HK;

Shengbo Lu, Hong Kong, HK;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61F 5/00 (2006.01); A61L 15/14 (2006.01); A61L 15/12 (2006.01); A61D 9/00 (2006.01);
U.S. Cl.
CPC ...
A61L 15/14 (2013.01); A61L 15/125 (2013.01); A61D 9/00 (2013.01);
Abstract

An electronically-activated, self-molding and re-shapeable load-bearing support structure system is provided that includes a first composite structure. The first composite structure includes a first layer of a first thermally-responsive polymer; one or more first heating elements positioned adjacent to the first layer on a first heating element side; a second layer of the first thermally-responsive polymer positioned adjacent to the first heating elements on a second heating element side; a temperature sensor communicating with at least the first layer or the second layer of the first thermally-responsive polymer; one or more electrical connectors electrically communicating with the heating elements; and an electrical controller detachably connectable to at least one of the electrical connectors of the composite for providing an electrical current to the heating elements. A method of molding the load-bearing support structure system is also provided.


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