The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Feb. 27, 2019
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

James A. Robbins, Groton, MA (US);

Jeffrey A. Shubrooks, South Boston, MA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0486 (2013.01); H01L 21/563 (2013.01); H01L 24/75 (2013.01); H01L 24/799 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 24/98 (2013.01); H05K 3/3436 (2013.01); H05K 3/3494 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/812 (2013.01); H01L 2224/814 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/8122 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92143 (2013.01); H01L 2224/98 (2013.01); H01L 2924/14 (2013.01); H05K 2203/176 (2013.01);
Abstract

A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.


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