The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Oct. 16, 2020
Applicant:
Shenzhen Chipuller Chip Technology Co., Ltd., Shenzhen, CN;
Inventors:
Jawad Nasrullah, Mountain View, CA (US);
Omar Alnaggar, Mountain View, CA (US);
Hanfeng Wang, Mountain View, CA (US);
Mohamed Sameh Mahmoud, Mountain View, CA (US);
Assignee:
SHENZHEN CHIPULLER CHIP TECHNOLOGY CO., LTD, Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 17/21 (2015.01); H04B 17/19 (2015.01); H04B 17/11 (2015.01); H04B 1/40 (2015.01); H01L 23/528 (2006.01); H04B 1/44 (2006.01);
U.S. Cl.
CPC ...
H04B 17/21 (2015.01); H01L 23/528 (2013.01); H04B 1/44 (2013.01); H04B 17/11 (2015.01); H04B 17/19 (2015.01);
Abstract
Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.
Quick Actions:
Nasrullah, Jawad. (2022). Method and apparatus to use active semiconductor interposers for rf signal chain in modular stacked integrated circuits (U.S. Patent No. 11329734). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11329734
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile