The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Jul. 01, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Hideyuki Fujimoto, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02355 (2021.01); H01S 5/024 (2006.01); H01S 5/02345 (2021.01); H01S 5/02212 (2021.01); H01S 5/02255 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02355 (2021.01); H01S 5/02345 (2021.01); H01S 5/02469 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01S 5/02212 (2013.01); H01S 5/02255 (2021.01);
Abstract

A semiconductor laser device includes: a housing including: a first upward-facing surface, at least one inner lateral surface, a recess defined by at least the first upward-facing surface and the at least one inner lateral surface, a second upward-facing surface surrounding the first upward-facing surface in a top view and located above the first upward-facing surface, and at least one third upward-facing surface formed outward of the second upward-facing surface in the top view, wherein a height of the at least one third upward-facing surface is different from a height of the second upward-facing surface; at least one first wiring part located in the recess; at least one second wiring part located on the at least one third-upward facing surface and electrically connected to the at least one first wiring part thorough an insulating part of the housing; a semiconductor laser element disposed on the first upward-facing surface of the housing; and a cap fixed to the second upward-facing surface and covering the semiconductor laser element.


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