The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Aug. 27, 2020
Applicant:

Egis Technology Inc., Taipei, TW;

Inventors:

Tzu-Yang Peng, Taipei, TW;

Ming-Yuan Cheng, Taipei, TW;

Chung-Yi Wang, Taipei, TW;

Yu-Hsuan Lin, Taipei, TW;

Assignee:

Egis Technology Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
H01L 27/14678 (2013.01); G06V 40/1318 (2022.01); H01L 27/14609 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01);
Abstract

A fingerprint sensing module including an image sensor, a microlens array and a light-shielding layer is provided. The image sensor has multiple pixels. Each of the pixels has multiple light-sensing regions physically separated. Each of the light-sensing regions is adapted to receive an image beam coming from a fingerprint of user. The microlens array is disposed above the image sensor. The microlens array includes multiple microlens. A focus region of each of the microlens covers a portion of the light-sensing regions. The light-shielding layer is disposed between the image sensor and the microlens array. The light-shielding layer has multiple openings, and the positions of the openings are corresponded to the positions of the pixels.


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