The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Sep. 18, 2018
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Tomohiro Sugiyama, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
The present disclosure relates to a semiconductor device, a manufacturing method of the semiconductor device, and electronic equipment that are directed to improving quality and reliability of a semiconductor device including a through electrode, or electronic equipment. The semiconductor device includes a first semiconductor substrate including a through electrode, a first insulating film laminated on a first surface of the first semiconductor substrate, and a second insulating film laminated on the first insulating film, in which an inner wall and a bottom surface of the through electrode are covered with a conductor, the first insulating film and the second insulating film are laminated on the conductor, and the through electrode includes a groove which reaches the first insulating film on the bottom surface from the first surface of the first semiconductor substrate. The present technology may be applied to a packaged solid-state imaging device or the like, for example.