The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

May. 15, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Pan Xu, Beijing, CN;

Yicheng Lin, Beijing, CN;

Ling Wang, Beijing, CN;

Guoying Wang, Beijing, CN;

Xing Zhang, Beijing, CN;

Ying Han, Beijing, CN;

Dongfang Yang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 5/03 (2006.01); H01L 25/10 (2006.01); H01L 27/12 (2006.01); G02F 1/133 (2006.01); G02F 1/1333 (2006.01); G04G 17/04 (2006.01); G04G 17/06 (2006.01); H01L 25/18 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 27/3276 (2013.01); H05K 1/189 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10962 (2013.01);
Abstract

The present disclosure provides a display device, including: a display panel, a main circuit board, and a plurality of chip-on-films bonded between the display panel and the main circuit board. The wiring area is provided with a plurality of first binding regions; the plurality of first binding regions are distributed along the wiring area. The main circuit board is provided with a plurality of second binding regions which are corresponding to the first binding regions in a one-to-one manner. A shape of the main circuit board is the same as a shape of the wiring area. A first end of each chip-on-film is bonded to one corresponding first binding region; a second end of each chip-on-film is bonded to one corresponding second binding region.


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