The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Feb. 21, 2018
Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Hiroaki Onuma, Sakai, JP;

Hiroyoshi Higashisaka, Sakai, JP;

Tsuyoshi Ono, Sakai, JP;

Takashi Ono, Sakai, JP;

Takashi Kurisu, Sakai, JP;

Yuhsuke Fujita, Sakai, JP;

Toshio Hata, Sakai, JP;

Katsuji Iguchi, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/50 (2013.01); H01L 33/0093 (2020.05); H01L 33/50 (2013.01);
Abstract

A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.


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