The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Jun. 19, 2019
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Sergey Bolotov, Tokyo, JP;
Yusuke Kubo, Tokyo, JP;
Assignee:
Dexerials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4871 (2013.01); H01L 23/367 (2013.01); H01L 23/3737 (2013.01);
Abstract
Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor deviceincludes a semiconductor device; a tubular conductive shield canprovided to surround a side surfaceof the semiconductor device; a conductive cooling member; and a conductive thermally conductive sheetformed between the semiconductor deviceand the cooling member. The conductive shield canand the cooling memberare electrically connected through the conductive thermally conductive sheettherebetween.