The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Jul. 24, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Teruyuki Sato, Kumamoto, JP;

Shinichi Arakawa, Kumamoto, JP;

Takayuki Enomoto, Kumamoto, JP;

Yohei Chiba, Kumamoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 27/146 (2006.01); H01L 21/027 (2006.01); H01L 21/266 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 27/1461 (2013.01); H01L 21/027 (2013.01); H01L 21/266 (2013.01); H01L 2223/54426 (2013.01);
Abstract

Fabrication of an alignment mark in a semiconductor device is simplified. A semiconductor device including a semiconductor substrate, an epitaxial layer, and an alignment mark is provided. The epitaxial layer included in the semiconductor device includes a single-crystalline semiconductor that is epitaxially grown on a surface of the semiconductor substrate included in the semiconductor device. The alignment mark included in the semiconductor device is disposed between the semiconductor substrate and the epitaxial layer.


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