The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Jul. 10, 2020
Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Feng Zhou, Ann Arbor, MI (US);
Shohei Nagai, Aichi, JP;
Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
Abstract
A power device embedded PCB includes a printed circuit board having a first major surface separated by a thickness and opposite a second major surface and an embedded power device. The embedded power device may include a power semiconductor device, an electrically and thermally conductive substrate bonded to the power semiconductor device along a first surface of the electrically and thermally conductive substrate and bonded to an electrical insulation layer on a second surface of the electrically and thermally conductive substrate opposite the first surface and a thermally conductive substrate bonded to the electrical insulation layer on a surface opposite the bonded electrically and thermally conductive substrate. The power semiconductor device, the electrically and thermally conductive substrate, the electrical insulation layer, and the thermally conductive substrate are disposed within the printed circuit board. The thermally conductive substrate forms a bondable surface adjacent the second major surface of the printed circuit board.