The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Jun. 11, 2019
Applicant:

Cobham Advanced Electronic Solutions, Inc., Lansdale, PA (US);

Inventor:

Sean Leighton Thorne, Colorado Springs, CO (US);

Assignee:

COBHAM COLORADO SPRINGS INC., Colorado Springs, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/13 (2006.01); H01L 23/40 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/13 (2013.01); H01L 23/40 (2013.01); H01L 24/16 (2013.01); H01L 24/72 (2013.01); H01L 24/90 (2013.01); H01L 2224/16227 (2013.01);
Abstract

This application is directed to a semiconductor system including a substrate, an electronic device, a plurality of compliant interconnects and a support structure. The substrate has a first surface and a plurality of first contacts formed on the first surface. The electronic device has a second surface facing the first surface of the substrate, and a plurality of second contacts formed on the second surface. The compliant interconnects are disposed between the first surface of the substrate and the second surface of the electronic device, and are configured to electrically couple the first contacts on the first surface of the substrate to the second contacts on the second surface of the electronic device. The support structure is coupled to the substrate and the electronic device, and extends beyond a footprint of the electronic device. The support structure is configured to mechanically couple the electronic device to the substrate.


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