The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Jul. 24, 2020
Infineon Technologies Ag, Neubiberg, DE;
Ingo Muri, Villach, AT;
Bernhard Goller, Villach, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A substrate wafer arrangement includes a substrate layer having a first main side and a second main side opposite the first main side, the first main side being a front-side and the second main side being a back-side, the substrate layer further having a plurality of semiconductor chips. A polymer structure arranged between the plurality of semiconductor chips extends at least from the front-side of the substrate layer to the back-side of the substrate layer and protrudes from a back-side surface of the substrate layer. The polymer structure separates a plurality of insular islands of conductive material, each insular island corresponding to a respective semiconductor chip of the plurality of semiconductor chips. Semiconductor devices produced from the substrate wafer arrangement are also described.