The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Sep. 04, 2020
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Mutsuaki Murakami, Osaka, JP;

Yuki Kawashima, Osaka, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76885 (2013.01); H01L 21/32136 (2013.01); H01L 23/528 (2013.01); H01L 23/53276 (2013.01);
Abstract

The present disclosure relates to a wiring circuit, and a method for producing the wiring circuit, that includes graphite wiring having a specified thickness, a high electrical conductivity, and a high carrier mobility. The wiring circuit may include graphite wiring comprised of graphite where the graphite wiring has a thickness of 3 nm or more and less than 300 nm. The graphite may have an electrical conductivity along a graphite film plane direction of 18000 S/cm or more, and the graphite may have a carrier mobility along the graphite film plane direction of 9500 cm/Vsec or more. The method for producing a wiring circuit may include steps of: (1) bonding a graphite film with a substrate; (2) plasma etching the graphite film to form a graphite thin film; and (3) etching the graphite thin film to form a wiring circuit.


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