The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Mar. 26, 2019
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventors:

Qiang Jia, Beijing, CN;

Peijun Ding, Beijing, CN;

Mengxin Zhao, Beijing, CN;

Hougong Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/00 (2006.01); H01L 21/67 (2006.01); H01L 21/324 (2006.01); C23C 14/22 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67098 (2013.01); C23C 14/228 (2013.01); H01L 21/324 (2013.01); H01L 21/6719 (2013.01); H01L 21/67115 (2013.01); C23C 14/22 (2013.01);
Abstract

A degassing chamber and a semiconductor processing apparatus are provided. The degassing chamber includes a chamber; a substrate container, movable within the chamber in a vertical direction; and a heating component, disposed within the chamber. A substrate transferring opening is formed through a sidewall of the chamber for transferring substrates into or out of the chamber. The heating component includes a first light source component and a second light source component. The chamber is divided into a first chamber and a second chamber by the substrate transferring opening. The first light source component is located in the first chamber, and the second light source component is located in the second chamber. The first light source component and the second light source component are provided for heating a substrate in the substrate container.


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