The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Apr. 24, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Mitsunori Inoue, Nagaokakyo, JP;

Tomohiko Mori, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 41/16 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01C 7/00 (2006.01); H01C 7/102 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01); H01F 41/16 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01C 7/008 (2013.01); H01C 7/102 (2013.01);
Abstract

A method of manufacturing a ceramic electronic component such that Voids of the ceramic element and voids at the interfaces between the ceramic element and the external electrodes are filled with a resin composition by applying, to the ceramic electronic component, a resin-containing solution that has the function of etching the surface of the ceramic element to ionize constituent elements of the ceramic element. The resin composition includes a resin, and cationic elements among the constituent elements of the ceramic elements, which are ionized and deposited from the ceramic element.


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