The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Feb. 19, 2019
Applicant:

Vibrant Composites, Inc., Boston, MA (US);

Inventors:

Pratheev S. Sreetharan, Cambridge, MA (US);

Andrew Baisch, Cambridge, MA (US);

Alina Visco, Somerville, MA (US);

Michael Karpelson, Newton, MA (US);

Assignee:

Vibrant Composites Inc., Boston, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B06B 1/04 (2006.01); B06B 1/10 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00357 (2013.01); B06B 1/045 (2013.01); B81C 1/0019 (2013.01); B81C 1/00142 (2013.01); B81C 1/00428 (2013.01); B81C 1/00492 (2013.01); B81C 1/00547 (2013.01); B06B 1/10 (2013.01); B81C 2201/0102 (2013.01); B81C 2201/0135 (2013.01);
Abstract

A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.


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