The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Oct. 19, 2017
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Jacob Lum, Corvallis, OR (US);

Jeremy Sells, Corvallis, OR (US);

Si-lam Choy, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/175 (2006.01); B41J 2/14 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/175 (2013.01); B41J 2/1404 (2013.01); B41J 2/0458 (2013.01); B41J 2/14145 (2013.01); B41J 2002/14403 (2013.01); B41J 2002/14467 (2013.01); B41J 2202/12 (2013.01);
Abstract

A fluidic die may include a fluid channel layer defining a number of fluid channels therein, a slot layer disposed on a side of the fluid channel layer, and a first fluid slot and a second fluid slot defined in the slot layer. At least one of the fluid channels fluidically couples the first fluid slot to the second fluid slot. The first fluid slot and the second fluid slot are defined in the slot layer along a length of the fluidic die.


Find Patent Forward Citations

Loading…