The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Sep. 06, 2019
Applicant:

Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, CN;

Inventor:

Hanning Yang, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/00 (2006.01); B05D 3/06 (2006.01); B32B 17/10 (2006.01); B32B 38/14 (2006.01); B32B 38/00 (2006.01); B32B 27/36 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); B32B 37/24 (2006.01); B32B 37/02 (2006.01); B32B 1/00 (2006.01); B29C 63/00 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10 (2013.01); B05D 3/007 (2013.01); B05D 3/06 (2013.01); B05D 3/065 (2013.01); B29C 63/0013 (2013.01); B32B 1/00 (2013.01); B32B 27/36 (2013.01); B32B 37/02 (2013.01); B32B 37/24 (2013.01); B32B 38/0004 (2013.01); B32B 38/0008 (2013.01); B32B 38/0012 (2013.01); B32B 38/10 (2013.01); B32B 38/14 (2013.01); B32B 43/006 (2013.01); H01L 51/0097 (2013.01); B05D 2505/50 (2013.01); B05D 2701/30 (2013.01); B32B 2037/243 (2013.01); B32B 2037/246 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/748 (2013.01); B32B 2310/0843 (2013.01); B32B 2379/08 (2013.01); B32B 2457/206 (2013.01); H01L 51/5284 (2013.01);
Abstract

A method for fabricating a display panel including a bending area includes: providing a substrate; forming a first flexible layer on the substrate; forming an organic layer on the first flexible layer, wherein a wavelength of light absorbed by the organic layer is different from a wavelength of light absorbed by the first flexible layer; irradiating a part of the organic layer in the bending area with a laser to make at least a portion of the part of the organic layer a carbonized layer, thereby forming a spacer layer; forming a second flexible layer covering the first flexible layer and the spacer layer, wherein the first flexible layer and the second flexible layer are made of a same material and separated by the spacer layer; and cutting a part of the substrate and a part of the first flexible layer in the bending area.


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