The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Jan. 09, 2020
Applicant:

Airbus Operations S.a.s., Toulouse, FR;

Inventors:

Karl Simon, Le Landreau, FR;

Florian Ravise, Saint-Herblain, FR;

Denis Brossard, Saint Aignan de Grand Lieu, FR;

Florian Chotard, Nantes, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/30 (2006.01); B29C 70/54 (2006.01); G10K 11/162 (2006.01); B29K 71/00 (2006.01); B29K 79/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 70/30 (2013.01); B29C 70/545 (2013.01); G10K 11/162 (2013.01); B29K 2071/00 (2013.01); B29K 2079/085 (2013.01); B29L 2031/3076 (2013.01);
Abstract

A method for producing an acoustically resistive structure includes the steps of creating, consolidating and cutting a first layer of reinforcing fibres embedded in a first thermoplastic resin having a first melting point so as to obtain an interlayer, a step of laying a second layer of reinforcing fibres against a first face of the interlayer, a second consolidation step of consolidating the second layer of reinforcing fibres embedded in a second thermoplastic resin having a second consolidation temperature lower than the first melting point of the first resin so as to obtain a non-perforated external layer bound to the interlayer, a step of perforating the external layer and a step of laying an internal layer on a second face of the interlayer. An acoustically resistive structure obtained from the method as well as a sound-absorption panel including such an acoustically resistive structure are also described.


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