The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Aug. 18, 2021
Applicant:

Suzhou Fusion Tech Co., Ltd., Suzhou, CN;

Inventors:

Jun Wang, Suzhou, CN;

Hanshen Wang, Suzhou, CN;

Jingwei Hu, Suzhou, CN;

Hua Feng, Suzhou, CN;

Jianzhe Li, Suzhou, CN;

Jinjing Zhang, Suzhou, CN;

Xiaoyu Wu, Suzhou, CN;

Wangping Long, Suzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 1/00 (2006.01); B28B 17/00 (2006.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

Disclosed are methods and systems for optimizing printing of a ceramic isolation layer. In some embodiments, the method includes the following steps: preparing a workpiece before printing; printing the workpiece by an optimal printing solution, the optimal printing solution satisfying a setting of key data when printing the ceramic isolation layer; and processing the workpiece after printing to obtain a finished workpiece. In other embodiments, the optimal printing solution is determined by the following steps: printing and processing the ceramic isolation layer and the workpiece isolated by the ceramic isolation layer for multiple times; adjusting the key data by determining a strength of the ceramic isolation layer after printing and deformation data of the workpiece; selecting the ceramic isolation layer parameters and the printing parameters; and taking the setting of the key data as the optimal solution when the deformation data reaches a preset threshold.


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