The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Jan. 09, 2018
Applicant:
Skc Solmics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Assignee:
SKC solmics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B29C 44/02 (2006.01); C08G 18/08 (2006.01); C08G 18/10 (2006.01); C08G 18/48 (2006.01); C08G 18/76 (2006.01); C08J 9/00 (2006.01); C08J 9/38 (2006.01); C08K 5/17 (2006.01); C08K 5/35 (2006.01); C08L 75/04 (2006.01); H01L 21/304 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); C08G 101/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B29C 44/02 (2013.01); C08G 18/10 (2013.01); C08G 18/14 (2013.01); C08K 5/17 (2013.01); C08K 5/35 (2013.01); C08G 2101/00 (2013.01); H01L 21/3212 (2013.01);
Abstract
An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.