The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Apr. 19, 2019
Applicant:

Ut-battelle, Llc, Oak Ridge, TN (US);

Inventors:

Alex E. Pawlowski, Oak Ridge, TN (US);

Amit Shyam, Knoxville, TN (US);

Derek A. Splitter, Knoxville, TN (US);

Amelia M. Elliott, Oak Ridge, TN (US);

Zachary C. Cordero, Houston, TX (US);

Assignee:

UT-BATTELLE, LLC, Oak Ridge, TN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/34 (2014.01); B23K 26/354 (2014.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); C22C 33/02 (2006.01); C22C 1/04 (2006.01); B22F 3/11 (2006.01); B22F 3/26 (2006.01); B22F 3/24 (2006.01); B22D 19/00 (2006.01); B22F 7/00 (2006.01); B22F 7/04 (2006.01); B22F 5/10 (2006.01); C22C 21/00 (2006.01); C22C 33/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/34 (2013.01); B22F 3/11 (2013.01); B22F 3/1115 (2013.01); B22F 3/26 (2013.01); B23K 26/354 (2015.10); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C22C 1/0475 (2013.01); C22C 33/0242 (2013.01); B22D 19/00 (2013.01); B22F 3/24 (2013.01); B22F 5/10 (2013.01); B22F 7/002 (2013.01); B22F 2007/045 (2013.01); C22C 21/00 (2013.01); C22C 33/00 (2013.01);
Abstract

A method for preparing metal/metal interpenetrating phase composites is provided. The method includes forming a preform using additive manufacturing. The preform defines a materially continuous three-dimensional open-cell mesh structure. The preform includes a first metal having a melting point. The method further includes pre-heating the preform to a first temperature less than the melting point of the first metal. The method includes infiltrating the preform with a second metal in liquid form. The second metal has a melting point lower than the melting point of the first metal. The method also includes allowing the second metal to cool and form a solid matrix. The solid matrix defines a continuous material network.


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