The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Jul. 12, 2018
Yamaha Hatsudoki Kabushiki Kaisha, Iwata, JP;
Masahiro Sano, Iwata, JP;
Ryodai Ito, Iwata, JP;
Akihiro Suzuki, Iwata, JP;
Shimpei Takeda, Iwata, JP;
Yasumi Yamamura, Iwata, JP;
YAMAHA HATSUDOKI KABUSHIKI KAISHA, Iwata, JP;
Abstract
A mold () according to an embodiment of the present invention is a mold which is formed by additive manufacturing. The mold includes: a heat medium channel () for a heat medium to flow through, the heat medium channel being provided inside the mold; a medium introduction port () at which the heat medium is to be introduced into the mold; a medium discharge port () at which the heat medium is to be discharged out of the mold; and a buffer layer () located between a mold surface () and the heat medium channel. The buffer layer includes a low-melting percentage portion () having a lower melting percentage than does any portion inside the mold other than the buffer layer.