The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Apr. 22, 2019
Applicant:

President and Fellows of Harvard College, Cambridge, MA (US);

Inventors:

Joanna Aizenberg, Boston, MA (US);

Tanya Shirman, Arlington, MA (US);

Nicolas Vogel, Cambridge, MA (US);

Mathias Kolle, Hull, MA (US);

Michael Aizenberg, Boston, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 35/10 (2006.01); C04B 38/00 (2006.01); B01J 23/52 (2006.01); B01J 37/00 (2006.01); B82Y 40/00 (2011.01); B82Y 30/00 (2011.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
B01J 35/10 (2013.01); B01J 23/52 (2013.01); B01J 37/0018 (2013.01); C04B 38/0096 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C04B 2111/0081 (2013.01);
Abstract

Methods for forming an interconnected network of solid material and pores, with metal residing only at the air/solid interface of the interconnected network structure are described. In certain embodiments, nanoparticle decorated sacrificial particles can be used as sacrificial templates for the formation of a porous structure having an interconnected network of solid material and interconnected network of pores. The nanoparticles reside predominantly at the air/solid interface and allow further growth and accessibility of the nanoparticles at defined positions of the interconnected structure. SEM and TEM measurements reveal the formation of 3D interconnected porous structures with nanoparticles residing predominantly at the air/solid interface of the interconnected structure.


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