The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Sep. 25, 2020
Applicant:
Chiun Mai Communication Systems, Inc., New Taipei, TW;
Inventor:
Yu-Wei Chang, New Taipei, TW;
Assignee:
Chiun Mai Communication Systems, Inc., New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28F 3/12 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 3/12 (2013.01); G06F 1/203 (2013.01); H05K 7/2029 (2013.01);
Abstract
A thin-profile composite heat dissipating structure for a heat-generating electronic device includes a heat sink and a heat pipe, the heat sink includes a first housing, a first heat dissipation liquid, and a gas. The first housing is sealed to form a first cavity, the first heat dissipation liquid and the gas are received in the first cavity. The heat pipe is connected to the first housing and a wick structure to allow the return of the condensed heat dissipation liquid by capillary action is disposed elsewhere. An electronic device using the structure is also provided.