The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Feb. 09, 2021
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Shota Sato, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01);
Abstract
A module () includes a substrate () having a main surface () and a conductor column () disposed on the main surface (). The conductor column () includes a conductor column body () and an overhanging part () overhanging from an outer periphery of the conductor column body () in a middle of a height direction of the conductor column body ().
Sato, Shota. (2022). Wiring substrate and module (U.S. Patent No. 11324108). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11324108
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile