The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Jun. 05, 2020
Kmw Inc., Hwaseong-si, KR;
Duk Yong Kim, Yongin-si, KR;
Jun Woo Yang, Hwaseong-si, KR;
Jin Soo Yeo, Hwaseong-si, KR;
Chang Woo Yoo, Hwaseong-si, KR;
Min Sik Park, Hwaseong-si, KR;
Hye Yeon Kim, Gangjin-gun, KR;
KMW INC., Hwaseong-si, KR;
Abstract
A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body. The heat transfer part has one end connected to the outer surface of the housing main body and another end connected to the additional cooling part to transfer heat generated from the plurality of electronic elements to the additional cooling part.