The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Nov. 28, 2018
Applicant:

Ifp Energies Nouvelles, Rueil-Malmaison, FR;

Inventors:

Alexandre Battiston, Rueil-Malmaison, FR;

Laid Kefsi, Garches, FR;

Fabrice Le Berr, Rueil-Malmaison, FR;

Assignee:

IFP ENERGIES NOUVELLES, Rueil-Malmaison, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 11/33 (2016.01); F01D 25/12 (2006.01); F02B 37/10 (2006.01); F02B 39/00 (2006.01); H02K 9/22 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); F01D 25/12 (2013.01); F02B 37/10 (2013.01); F02B 39/005 (2013.01); H02K 9/22 (2013.01); H05K 7/20172 (2013.01); H05K 7/20272 (2013.01); H05K 7/20918 (2013.01); H05K 7/20927 (2013.01); F05D 2220/40 (2013.01); F05D 2260/20 (2013.01); H02K 2211/03 (2013.01);
Abstract

The invention is a device () for cooling a power electronic system (EP) comprising at least one power electronic component () mounted on at least one circuit board (), the cooling device () comprises a hose () for circulating a flow () at an ambient temperature. The cooling device () comprises a first heat exchange surface () that is thermally connected to the power electronic components () and at least one second heat exchange surface (). The second heat exchange surface () is for heat exchange with the flow () circulating through the hose. The second heat exchange surface () is fitted inside the circulation hose () to remove heat by convection with the circulating flow (). The second heat exchange surface () is thermally connected to the first heat exchange surface ().


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