The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Mar. 21, 2019
Applicant:

Cheng Uei Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Yun-Feng Zhang, Dong-Guan, CN;

Zhi-Bin Dong, Dong-Guan, CN;

Feng Zhu, Dong-Guan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H01R 43/24 (2006.01); B29C 45/64 (2006.01); B29C 45/26 (2006.01); B29L 31/36 (2006.01);
U.S. Cl.
CPC ...
H01R 43/24 (2013.01); B29C 45/26 (2013.01); B29C 45/64 (2013.01); B29L 2031/36 (2013.01);
Abstract

An injection mold for molding an electrical connector assembly which includes a plurality of terminals, a clamping component located above the plurality of the terminals, and a base body fastened to the plurality of the terminals and the clamping component. The injection mold includes a lower mold and an upper mold. The lower mold has a plurality of lower terminal grooves. Lower portions of the plurality of the terminals are placed in the plurality of the lower terminal grooves. The clamping component is placed on the lower mold. The upper mold is engaged with and mounted on the lower mold. A molding cavity is formed between the upper mold and the lower mold. The upper mold has a plurality of upper terminal grooves. Upper portions of the plurality of the terminals are placed in the plurality of the upper terminal grooves.


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