The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Nov. 26, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Je Hun Jong, Suwon-si, KR;

Se Hyun Park, Suwon-si, KR;

Su Min Yun, Suwon-si, KR;

Myung Hun Jeong, Suwon-si, KR;

Jae Hoon Jo, Suwon-si, KR;

Jin Woo Jung, Suwon-si, KR;

Jae Bong Chun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/42 (2006.01); H01Q 1/38 (2006.01); H01Q 1/52 (2006.01); H01Q 11/14 (2006.01); H01Q 19/13 (2006.01); H01Q 21/00 (2006.01); H01Q 1/24 (2006.01); H01Q 21/28 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/422 (2013.01); H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 1/523 (2013.01); H01Q 11/14 (2013.01); H01Q 19/138 (2013.01); H01Q 21/0031 (2013.01); H01Q 21/062 (2013.01); H01Q 21/28 (2013.01);
Abstract

An electronic device includes a housing that includes a first plate, a second plate facing a direction opposite the first plate, and a side member surrounding a space between the first plate and the second plate, an antenna structure that includes a plurality of dielectric layers perpendicular to the side member and parallel to the first plate, a first array of conductive plates aligned in a first direction perpendicular to the first plate at a first dielectric layer of the dielectric layers, a second array of conductive plates spaced from the first array and aligned in the first direction at the first dielectric layer, wherein the second array is farther from the first plate than the first array, at least one ground plane positioned on at least one of the dielectric layers and interposed between the first array and the second array, when viewed from above the side member, and a wireless communication circuit electrically connected to the first array and the second array and configured to transmit and/or receive a signal having a frequency in a range of 20 GHz to 100 GHz.


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