The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Sep. 03, 2018
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Shih-Chia Chiu, Hsin-Chu, TW;
Yen-Ju Lu, Hsin-Chu, TW;
Wen-Chou Wu, Hsin-Chu, TW;
Nan-Cheng Chen, Hsin-Chu, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01Q 21/06 (2006.01); H01L 23/14 (2006.01); H01Q 15/00 (2006.01); H01Q 19/06 (2006.01); H01Q 15/10 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/145 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01Q 15/0013 (2013.01); H01Q 15/10 (2013.01); H01Q 19/062 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01);
Abstract
A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.