The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Nov. 18, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John Collins, Tarrytown, NY (US);

John M. Papalia, New York, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Matthew Sagianis, Bayside, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 6/40 (2006.01); H01M 50/10 (2021.01); H01M 10/052 (2010.01); H01M 10/04 (2006.01); H01M 10/02 (2006.01); H01M 10/0565 (2010.01); H01M 10/0585 (2010.01);
U.S. Cl.
CPC ...
H01M 50/10 (2021.01); H01M 10/02 (2013.01); H01M 10/0436 (2013.01); H01M 10/052 (2013.01); H01M 10/0565 (2013.01); H01M 10/0585 (2013.01); H01M 2220/30 (2013.01); H01M 2300/0082 (2013.01); H01M 2300/0094 (2013.01);
Abstract

An energy storage device has all components, e.g. anode, electrolyte, and cathode contained and sealed with a trench in a substrate. Various methods and structures are disclosed for sealing the components. In some embodiments, a sealer or sealing layer seals the components. One embodiment uses a tension clamp to contain the components with additional pressure. Another embodiment uses a cathode structure cup which is held in place in the substrate via sidewall trench features. Different external connections to the device are disclosed. The invention enables full three-dimensional components to be created and contained entirely within the substrate during assembly, curing, galvanic cycling and other manufacturing processes and provides improved sealing of the components during device operation.


Find Patent Forward Citations

Loading…