The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Apr. 29, 2019
Applicants:
Boe Optical Science and Technology Co., Ltd., Jiangsu, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Inventor:
Tao Wang, Beijing, CN;
Assignees:
BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD., Jiangsu, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/642 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 2224/29022 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0075 (2013.01);
Abstract
The present disclosure provides a light-emitting diode, a method for manufacturing the same, a backlight source and a display device. The light-emitting diode includes a support having a bottom wall, a light-emitting chip on the support, and a die bonding structure. A through hole is provided in the bottom wall. At least a portion of the die bonding structure is located in the through hole. The light-emitting chip is attached to the bottom wall through the die bonding structure.