The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Mar. 25, 2020
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Makoto Utsumi, Matsumoto, JP;

Tsuyoshi Araoka, Tsukuba, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 29/4236 (2013.01);
Abstract

A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate of a first conductivity type, a first silicon carbide semiconductor layer of the first conductivity type, a second silicon carbide semiconductor layer of a second conductivity type, a first silicon carbide semiconductor region of the first conductivity type, a trench, and a gate electrode on a gate insulating film. Between the gate insulating film and any one among the first silicon carbide semiconductor layer, the second silicon carbide semiconductor layer, and the first silicon carbide semiconductor region is an interface section where a concentration of oxygen varies, the interface section having closer to the gate insulating film than to the any one among the first silicon carbide semiconductor layer, the second silicon carbide semiconductor layer, and the first silicon carbide semiconductor region, a region where a rate of increase of the oxygen included in the interface section is greatest.


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