The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Jun. 04, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Yukio Yamamoto, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A moduleincludes an upper module including a substrate, a first component, and a sealing resin layer, and a lower module including an intermediate layer and a redistribution layer. The first component is connected to the redistribution layer with a columnar conductor interposed therebetween and provided in the intermediate layer, and both the first component and a second component are rewired by the redistribution layer. Since the intermediate layer is formed by using a frame-shaped substrate, the upper module and the lower module can be connected without necessarily a bump, so that it is possible to provide a module which has a fanout-type package-on-package structure and can be easily reduced in height.