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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11322459 B1

PDFFull Text
Date of Patent:
May. 03, 2022

Filed:

Mar. 08, 2019

Lead of semiconductor device having a side surface with a plurality of recess areas

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Ryuichi Furutani, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01); H05K 5/02 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3675 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01);
Abstract

A semiconductor device includes a lead, a first semiconductor element, and a sealing resin that covers at least a portion of each of the lead and the first semiconductor element. The lead has an obverse surface on which the first semiconductor element is mounted, and a reverse surface opposite to the obverse surface. The lead includes a first portion having a first surface. The first surface is located between the obverse surface and the reverse surface in the z direction in which the obverse surface and the reverse surface are separated from each other. The first surface of the lead is covered with the sealing resin, and is configured with a plurality of protruding areas and a plurality of recessed areas arranged alternately as viewed in the z direction.

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