The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Jan. 17, 2018
Applicant:
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Inventor:
Kosuke Ikeda, Saitama, JP;
Assignee:
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/5385 (2013.01); H01L 25/065 (2013.01);
Abstract
An electronic module has a first substrate; a second substrateprovided in one side of the first substrate; and a chip moduleprovided between the first substrateand the second substrate. The chip modulehas an electronic elementand a connecting bodyelectrically connected to the electronic element. The electronic elementextends along a first direction that is a thickness direction of the electronic module.