The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Nov. 19, 2018
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka, JP;

Inventors:

Shinya Kawakita, Tokyo, JP;

Hideyuki Sakamoto, Hitachinaka, JP;

Assignee:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 23/3107 (2013.01); H01L 24/73 (2013.01); H05K 7/20472 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic control device includes: a board; a heat generating component mounted on the board; a heat conductive sheet thermally coupled to one surface of the heat generating component located on a side opposite to the board side; and a cooling mechanism thermally coupled to the heat conductive sheet. The heat conductive sheet includes a folded structure having a plurality of folded-back portions and a plurality of connection portions provided between the folded-back portions, and the plurality of folded-back portions of the heat conductive sheet is thermally coupled to each of the heat generating component and the cooling mechanism.


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