The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Nov. 15, 2019
Tdk Corporation, Tokyo, JP;
Yongfu Cai, Tokyo, JP;
Shuhei Miyazaki, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. Assemblyof stacked elements has: first elementhaving first surface; resin layerthat is arranged on first surfaceand that contains a plurality of fillers F; and second elementthat is arranged on resin layerand that has second surfacethat is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers Fthat are in contact with second surfaceis larger than the average flattening ratio of fillers F, Fthat are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surfaceto the maximum thickness of the filler in a direction perpendicular to second surface