The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Jun. 04, 2020
Applicant:
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Inventors:
Julien Borrel, Le Versoud, FR;
Magali Gregoire, Crolles, FR;
Assignee:
STMicroelectronics (Crolles 2) SAS, Crolles, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/321 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 21/762 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32053 (2013.01); H01L 21/26586 (2013.01); H01L 21/324 (2013.01); H01L 21/76224 (2013.01); H01L 29/456 (2013.01);
Abstract
Atoms are implanted in a semiconductor region at a higher concentration in a peripheral part of the semiconductor region than in a central part of the semiconductor region. A metallic region is then formed to cover the semiconductor region. A heat treatment is the performed to form an intermetallic region from the metallic region and the semiconductor region.