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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11322325 B1

PDFFull Text
Date of Patent:
May. 03, 2022

Filed:

Dec. 14, 2017

Power relay assembly

Applicant:

Amogreentech Co., Ltd., Gimpo-si, KR;

Inventors:

Min Ho Won, Incheon, KR;

Seung Jae Hwang, Incheon, KR;

Assignee:

Amogreentech Co., Ltd., Gimpo-si, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Zachary Pape

Assistant Examiner:

Amir A Jalali

Int. Cl.
CPC ...
H01H 45/12 (2006.01); H01H 45/04 (2006.01); B60R 16/02 (2006.01); H02B 1/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H02G 5/06 (2006.01); B60R 16/023 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01H 45/12 (2013.01); B60R 16/02 (2013.01); H01H 45/04 (2013.01); H02B 1/46 (2013.01); H02G 5/06 (2013.01); H05K 1/0207 (2013.01); H05K 1/0209 (2013.01); H05K 1/181 (2013.01); B60R 16/0238 (2013.01); B60Y 2200/91 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10181 (2013.01);
Abstract

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: a support plate having at least one electric element mounted on one surface thereof and including a plastic material having heat dissipation and insulation properties; and at least one bus bar electrically connected to the electric element and partially embedded in the support plate. Due to these features, since heat generated from the bus bar and the electric element is dissipated to the outside through the support plate, it is possible to prevent performance deterioration due to heat and breakage of electronic components.

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