The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Apr. 27, 2020
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Qing Qian, Shanghai, CN;

Wei Li, Shanghai, CN;

Hui Juan Yan, Shanghai, CN;

Hui Yang, Shanghai, CN;

Wei Peng Nian, Shanghai, CN;

Ting Shi, Shanghai, CN;

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/4206 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 2201/10121 (2013.01);
Abstract

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.


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